To test the adhesion between the plated layer and the base substrate.
Plated products is tested by tapping with tape or bending the plated product with bending device.
To test the plated product solderability.
Plated products is tested by dipping the plated product into melting solder, and then the solder coverage on the surface will be checked.
To test if there are any pores / pin-holes on the plated product.
Plated product is tested with the procedure provide by our customer. (Only if the Golden Plate Electroplating has the facilities to conduct such tests.)